Terpene phenols are widely regarded as having the highest polarity of all tackifiers.

They provide outstanding specific adhesion in EVA and SBC systems. Their polarity and high softening points combine to provide excellent hot tack in bookbinding and packaging applications. These versatile resins can even be used in bookbinding adhesives that require resistance to ink oil. They will improve the adhesion of hot melt packaging and pressure sensitive adhesives to difficult-to-bond substrates like coated and recycled paper, glass and metal foils.

To view and/or print a Product Data Sheet (PDS) or Safety Data Sheet (SDS) for any of these products, click here.

 

Manufactured in the US

SYLVARES™ TP 96

A low softening point terpene phenol resin with broad polymer compatibility, designed to improve the tack, peel and flexibility of hot melt packaging and pressure sensitive adhesives.

SYLVARES™ TP 2040

A thermoplastic terpene phenolic resin designed for tackifying hot melt adhesives to provide superior adhesion and thermal-stability properties.

SYLVARES™ TP 115P

A thermoplastic resin is designed for tackifying hot melt adhesives to provide superior adhesion, thermal stability and strength properties.

SYLVARES™ TP 2040HM

A thermoplastic terpene phenolic resin with a higher softening point version of our SYLVARES™TP 2040.

SYLVARES™ TP 300

A thermoplastic terpene phenolic resin designed for tackifying hot melt adhesives to provide superior adhesion and thermal-stability properties.

SYLVARES™ TP 2040LO

A terpene phenolic resin with reduced odor characteristics. This thermoplastic resin is designed for tackifying hot melt adhesives to provide superior adhesion and thermal-stability properties.

SYLVARES™ TP 2019

A thermoplastic terpene phenolic resin has a high terpene level which exhibits excellent tackifying, flexibility, and compatibility properties for use in numerous polymers for adhesives.

SYLVARES™ TP 7042

A thermoplastic terpene phenolic resin designed for tackifying hot melt adhesives to provide superior adhesion and thermal-stability properties and significantly increase the performance range of a HMA in terms of substrates and line speeds.